Solar Cell Fiber Laser Scribing Machine Cell Cutting Machine Manual Working

Introduction:

The 30w fiber laser with optics isolation system has high stability and good scribing quality, better than traditional lamp-pumped and diode laser.  Its 1,064 nm laser wavelength could scribe on silicon wafer/ solar cell/ ceramic wafer/ thin metal sheet.

Application and Market:

Scribing and cutting for mono-crystalline silicon, poly-crystalline silicon, amorphous-crystalline silicon, solar cell, Silicon.

Features:  

● Great laser quality/ reliability

● Very Low operation cost

● Maintenance-free

● Compact design

● Easy operation and professional software

Advantage:

●Marble working platform and KK module from Hiwi,Taiwan keeps stable running and accuracy

●Adopt high speed and low voltage servo in avoid of breakdown from Motion structure encoder feedback wire fatigue

●Fiber focal fine-tuning design with straight in type,no need to adjust the light deviation and decrease default rate

●Auto electrical pedal with automatic inhale to improve efficiency

Technical Parameters:

Laser output: 20KHz~100KHz continuous adjustable

Laser wavelength:1,064 nm

Laser power: 30w(400mm/s)

Laser output power:10%-100% adjustable

Laser quality:M2 <1.8

Scribing speed: 400mm/s(30w)

Cutting scribing accuracy:±0.05 mm

Scribing cell size: max 210*210mm

Worktable size:220*220mm

CNC worktable accuracy: ±0.01 mm

Cooling:by air

Running temperature:15-35degree

Power supply: 1-phase 220VAC,50Hz

Dimension:950*750*1380mm

Weight:200KG